The Indian Defence Ministry is set to approve a historic ₹3.25 lakh crore deal for 114 Rafale fighter jets this week. The agreement, coinciding with President Macron’s visit, emphasizes "Make in India," with 100 jets to be manufactured locally through advanced technology transfers.
Beyond its business value, the transaction has broader strategic implications. It portrays Mahindra as a reliable mobility partner in Indonesia's national development goal while also emphasising India's expanding role as a provider of scalable, made-in-India mobility solutions.
In a landmark step strengthening Russo-Indian cooperation in the aerospace industry, Russia's United Aircraft Corporation (UAC) and India's Hindustan Aeronautics Limited (HAL) have signed...
India’s electronics exports hit a record $47 billion in 2025, driven by $30 billion in smartphone exports. Now the world's second-largest mobile manufacturer, the sector has created 25 lakh jobs and transitioned electronics into India’s third-largest export category under the PLI scheme.
India edges closer to enhancing air power as the Defence Procurement Board approves buying 114 Rafale fighter jets from France's Dassault Aviation. Chaired by Defence Secretary Rajesh Kumar Singh, the proposal now awaits Defence Minister Rajnath Singh's DAC and PM Modi's CCS nod. A February Modi-Macron meet could seal it, featuring Make in India tech transfers, 55-60% local content, Indian weapons integration, and a new Hyderabad fuselage plant while Tejas Mk-1A and AMCA proceed independently.
The scanner developed by VoxelGrids employs a helium-free "dry magnet" design, eliminating the need for expensive liquid helium coolant. This makes the system approximately 40% cheaper to manufacture, significantly more energy-efficient, lighter (2-3 tonnes vs. traditional 6 tonnes), and compact, ideal for smaller hospitals and potential mobile deployments in rural areas.
Reports say the talks between Indian semiconductor companies and Apple center on outsourced semiconductor assembly and test (OAST) processes, particularly, the backend steps of assembling dies into finished chips and packaging them, rather than full chip fabrication.